Industry Leaders to Speak April 1st in Beijing at the China National Convention Center
February 22, 2019 (Norwood, MA.) - EDI CON China 2019, taking place April 1-3, 2019 at the China National Convention Center (Beijing, China), has announced its lineup of keynote speakers for this year’s event. The keynotes will kick off the three-day conference and exhibition at 9:30 on Monday April 1 in Function Hall A (1st Floor). The talks include:
“Power Related Considerations in RF, Microwave and High-Speed Circuits”
Steve Sandler, Founder and CTO, Picotest
As engineers, we are tasked with achieving optimum performance for our RF, microwave and high-speed digital circuits. Yet we often design, simulate, and measure performance without considering the influence the power supply has on these circuits. What does it mean to consider the power supply influence? This discussion looks at the many ways the power supply impacts RF, microwave and high-speed digital systems and explains one of my favorite techniques for simulating, measuring and troubleshooting these complex issues.
Steve Sandler has been involved with power system engineering for nearly 40 years. The founder and CEO of Picotest.com, a company specializing in instruments and accessories for high-performance power system and distributed system testing, Steve is also the founder of AEi Systems, a company that specializes in worst-case circuit analysis for high-reliability industries. Steve serves as a member of Signal Integrity Journal’s editorial advisory board.
“5G Test & Measurement Technologies for Network Equipment Manufacturers, Chipsets, and Devices”
Kailash Narayanan, Global VP of Keysight Wireless Device Organization
With the publication of 3GPP release 15, the wireless industry has begun the race toward volume production of 5G equipment, devices, and initial deployments. This presentation surveys the major market trends and challenges ahead and gives an overview of test & measurement solutions.
Kailash Narayanan is Vice President and General Manager at Keysight Technologies. He leads the Wireless Industry Solutions business segment and is responsible for R&D, product and solution development, marketing and sales, and delivery to the wireless ecosystem that includes chipset makers, device industry, contract manufacturers, ODMs and service providers. Kailash has a BS degree in Electronics and Communication Engineering, MS in Electrical Engineering and Computer Science from the University of Illinois, Chicago and an MBA from Walden University.
“5G New Radio Test & Measurement Challenges and How to Address Them”
Alexander Pabst, Vice President Systems and Projects, Rohde & Schwarz
NR, the 5th Generation New Radio communication system is about to trigger the next revolution by including everything and everyone into a global communication grid. The increasing demand of capacity requires the deployment of new spectrum both in the established spectrum (Frequency Range 1 = FR1) as well as in the mmWave range (Frequency Range 2 = FR2), i.e. in the range of 30 GHz and beyond. For FR2, highly adaptive, beamforming antennas are an essential part of the game which comes along with highly challenging over the air (OTA) test and measurement (T&M) needs. But also in FR1 we see much more complex and more densely integrated architectures specifically in base stations that call for new, innovative test methods including OTA.
This talk will address the 5G NR OTA challenges and outline solutions for radiated test environments that optimize technical feasibility, test times/duration and investment/maintenance needs. Different geometries and form factors, frequency ranges and environmental conditions will be discussed reflecting the latest developments in the relevant standardization organizations such as 3GPP, CTIA, ETSI, etc.
Alexander Pabst joined Rohde & Schwarz in 1997. Since then he had held several product management positions within the Test & Measurement Division before he became Vice President of the systems group within the Test & Measurement Division in 2014. His international responsibility includes development and integration teams in Singapore and China
After the keynotes, the three-day conference and exhibition will open with tracks in 5G Advanced Communications, Power Integrity, Simulation & Modeling, Test & Measurement, mmWave, Amplifier Design, Low Power/IoT, Front-End Design, RF/MW Design, and Signal Integrity. The conference will also include a series of talks in the Keysight Education Forum. Keysight is the event’s host sponsor. Other major sponsors include Rohde & Schwarz, Diamond Sponsor, as well as Gold Sponsors: Mini-Circuits, UniCompound, WIN Semiconductors, Sichuan YiFeng Electronic Science & Technology Co. Ltd., and Xiamen Sanan Integrated Circuit Co., Ltd.
About EDI CON
Celebrating its seventh year in 2019, EDI CON China uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, and poster sessions while the conference hosts educational talks and workshops that address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON China is organized by Microwave Journal, Signal Integrity Journal, and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as EDI CON USA as well as the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.
Michel Zoghob, Event Director
Carl Sheffres, Exhibition Manager
TECHNICAL PROGRAM CONTACT:
Janine Love, Technical Program Director