The conference & exhibition will take place April 1-3 in Beijing
November 7, 2018 (Norwood, MA.) - EDI CON China 2019, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 1-3, 2019 at the China National Convention Center (Beijing, China), announces the Call for Abstracts for its technical sessions is open. The EDI CON CHINA Technical Advisory Committee evaluates all submitted abstracts for quality and educational relevance for conference attendees.
In its seventh year, EDI CON China 2019 will include technical conference sessions as well as workshops, panels, keynotes, and demonstrations from industry leading exhibitors in the RF, microwave, and high-speed digital industries. Authors wishing to submit an abstract can do so here. Talks can be given in English or Chinese, and the event will provide real-time translation from English to Chinese for native language engineers.
Focused on providing actionable information to practicing engineers, EDI CON offers specialized conference tracks to appeal to engineers looking for in-depth technical information to address today’s design challenges. Planned tracks include 5G and Blockchain Technologies, 5G/Advanced Communications , mmWave Technologies, RF/Microwave Amplifier Design, EMC/EMI, Low Power RF and IoT, Front End Design, Power Integrity, Radar and Defense, RF and Microwave Design, Signal Integrity, Simulation and Modeling, and Test and Measurement.
To be selected as part of the EDI CON China 2019 technical program, abstracts must provide a sufficient level of technical detail for the Technical Advisory Committee. Submissions should be high quality and detailed, aimed at advancing the knowledge of attendees. Abstracts will be evaluated on quality, relevance, impact, and originality. While prospective authors can reference products in a design case study or as a proof of concept for a design methodology, overt commercial content is not acceptable in session proposals.
Abstracts will be accepted until January 10, 2019 through the online portal system: www.ediconchina.com/cfa
About EDI CON
Celebrating its seventh year in 2019, EDI CON China uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, and poster sessions while the conference hosts educational talks and workshops that address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON China is organized by Microwave Journal, Signal Integrity Journal, and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as EDI CON USA as well as the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.
Michel Zoghob, Event Director
Carl Sheffres, Exhibition Manager
TECHNICAL PROGRAM CONTACT:
Janine Love, Technical Program Director