EDI CON China 2018 Announces Finalists In Innovation Awards

Winners to be announced at the exhibition on March 20th

March 2, 2018 (Norwood, Mass.) - EDI CON China 2018, a conference and exhibition that brings together engineers working on high-frequency analog and high-speed digital designs, taking place March 20-22, 2018 at the China National Convention Center (Beijing, China), announces the finalists in the first EDI CON Innovation Awards. This award program honors products that have had the greatest impact on the industry this year, providing the tools necessary to bring on the next generation of electronic design innovations.

Nominations were open to all exhibitors at EDI CON CHINA 2018 (see who’s exhibiting). Winners will be announced on the exhibit hall floor at EDI CON CHINA on Tuesday March 20, 2018 at the China National Convention Center in Beijing, China.

A panel made up of Microwave Journal and Signal Integrity Journal editors and EDI CON advisory board members determined the 15 finalists and will select the winners. Each finalist will receive signs for display in their booths at EDI CON CHINA 2018. Entries were judged on innovation, including consideration of product functionality, ease of use, cost effectiveness, and other factors.Ā 

“We always have an impressive number of innovative products displayed during our exhibition at EDI CON CHINA,” said Michel Zoghob, Event Director, “We are happy to introduce a program that recognizes the best of the best. Our hearty congratulations to the finalists!”

Finalists in the EDI CON China 2018 Innovation Awards are:
Test & Measurement

  • Focus Microwaves MPT-110200 Multi-Harmonic Tuner, 20-110GHz
  • National Instruments MIMO Prototyping System
  • National Instruments mmWave Transceiver System
  • Pasternack 1.0mm Flexible VNA Test Cables Operating up to 110 GHz


  • ANSYS Discovery Live (instantaneous 3D simulation)
  • Polar Instruments Field Solving PCB Transmission Line Design System Polar Si9000e


  • Analog Devices AD9172 Dual, 16-Bit, 12.6 GSPS RF DAC with Channelizers
  • Analog Devices AD9375 Integrated, Dual RF Transceiver with Observation Path
  • Anokiwave AWA-0134 5G 28 GHz 256-Element Active Antenna Innovator’s Kit
  • Teledyne e2v EV12AD550A dual channel, S-band capable, space grade ADC

Components, Cables, & Connectors

  • Mini Circuits DDCH-35-252+ dual directional coupler
  • Pasternack PEM010 60 GHz WR-15 Waveguide Tx Module
  • Sage Millimeter D-Band (WR-06) Compact Faraday Isolator

Materials, PCBs and Packaging

  • Premix Oy PREPERMĀ® 3D-filament product family for 3D printing
  • Rogers Corporation XtremeSpeed RO1200 Laminates for high-speed designs


In addition to its extensive exhibition, EDI CON China 2018 includes technical conference sessions as well as workshops, panels, keynotes, poster sessions, and demonstrations from industry leading exhibitors in the RF, microwave, and high-speed digital industries. Technical program talks will be given in English and Chinese, and the event will provide real-time transition into Chinese for English talks.

More information on EDI CON CHINA, including registration, the technical program, and venue/hotel information, can be found at www.ediconchina.com. Winners will be announced on March 20th at EDI CON CHINA.

In its sixth year in 2018, EDI CON China uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, consumer electronics, aerospace, and medical industries.

Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, and poster sessions while the conference hosts educational talks and workshops that address all aspects of design, simulation, test, and verification.

About the Organizers
EDI CON China is organized by Microwave Journal, Signal Integrity Journal, and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as EDI CON USA as well as the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.

Michel Zoghob, Event Director

Carl Sheffres, Exhibition Manager

Adonis Mak
ACT International
(852) 28386298

Janine Love, Technical Program Director
Twitter: @tb_janine