The conference & exhibition returns to Beijing in 2018
September 25, 2017 (Norwood, Mass.) - EDI CON China 2018, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place March 20-22, 2018 at the China National Convention Center (Beijing, China), announces the Call for Abstracts for its technical sessions is open. All submitted abstracts will be evaluated by the EDI CON CHINA 2018 Technical Advisory Committee for quality and educational relevance for conference attendees.
In its sixth year, EDI CON China 2018 will include technical conference sessions as well as workshops, panels, keynotes, poster sessions, and demonstrations from industry leading exhibitors in the RF, microwave, and high-speed digital industries. Authors wishing to submit and abstract can do so here. Talks can be given in English, and the event will provide real-time translation into Chinese. (Talks can also be given in Chinese.)
Focused on providing actionable information to practicing engineers, EDI CON offers specialized conference tracks to appeal to engineers looking for in-depth technical information to address today’s design challenges. Planned tracks include RF & Microwave Design, Mobile Front End Design, Low Power RF & IoT, 5G & Advanced Communications, Broadband Networks, Radar & Defense, Amplifier Design, Signal Integrity, Power Integrity, EMC/EMI, Simulation & Modeling, and Test & Measurement.
To be selected as part of the EDI CON China 2018 technical program, abstracts must provide a sufficient level of technical detail for the Technical Advisory Committee. Submissions should be high quality and detailed, aimed at advancing the knowledge of attendees. Abstracts will be evaluated on quality, relevance, impact, and originality. While prospective authors can reference products in a design case study or as a proof of concept for a design methodology, overt commercial content is not acceptable in session proposals.
Abstracts will be accepted until November 30, 2017 through the online portal system: www.ediconchina.com/cfa
About EDI CON
EDI CON China uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, and poster sessions while the conference hosts educational talks and workshops that address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON China is organized by Microwave Journal and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as EDI CON USA and the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.
CONFERENCE/TECHNICAL PROGRAM CONTACT:
Janine Love, Technical Program Director
Carl Sheffres, Exhibition Manager
Michel Zoghob, Event Director