EDI CON China 2016 Adds RF Silicon on Insulator Track and Keynote

March 17, 2016 (Norwood, Mass.) - EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC), is pleased to announce that GLOBALFOUNDRIES' Peter Rabbeni, Sr. Director, RF BU Business Development & Product Marketing, will kick off the newly added RF Silicon on Insulator (SOI) Technology Track with a keynote talk entitled, "RF SOI: Revolutionizing Radio Design Today and Driving Innovation for Tomorrow." The SOI Track will also feature talks and workshops from Peregrine Semiconductor, TowerJazz, Simgui, AnalogSmith and Shanghai Jiao Tong University. The talks will cover substrate engineering, design enablement, CMOS power amplifier design techniques and highly integrated control devices.

Mr. Rabbeni's keynote talk will cover how there has been dramatic growth in RF SOI over the last several years in its continued march in driving performance improvement, cost reduction and architecture innovation between the transceiver and the antenna in mobile radios. No other radio technology in recent memory has had the impact that RF SOI has had in this respect. With standards becoming increasingly more challenging and the pending introduction of 5G, RF SOI is expected to continue to play an important role in the development of innovative architectures. His presentation will explore where we have been, why and where we may be headed with this technology. Substrate engineering and SOI device technology is reviewed in detail in Microwave Journal's October 2015 cover story at http://www.microwavejournal.com/articles/25255.

EDI CON China 2016 recently announced the co-location of the China Radar Industry Association Conference and EMC China Conference/Exhibition. Organizers expect to attract more than 3,000 attendees during the 3-day event with 80 paper sessions and more than 30 workshops and panels. The technical sessions will be organized around tracks focused on RF, microwave and high-speed digital design, RF/microwave modeling and measurement, EMC/EMI, high-speed digital modeling and measurement, system-level measurements and modeling, and systems engineering. More information is available at www.ediconchina.com.


EDI CON China is an industry-driven conference/exhibition targeting RF/microwave, EMC/EMI and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks, such as 4G LTE, 5G, IoT, SATCOM and microwave backhaul. For more information about EDI CON China 2016, please visit www.ediconchina.com.

Editorial Contacts:
EDI CON China:
Horizon House Publications (rep. by ACT)
Katie Huang

EDI CON International:
Pat Hindle
+1 781 619 1946
Twitter: @pathindle