June 24, 2015 (Norwood, Mass.) - EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC), is pleased to announce their Call for Papers. Authors are invited to submit technical oral session abstracts/proposals describing work in RF/microwave, EMC/EMI and high-speed digital electronic component or system-level design, modeling or testing. The EDI CON Technical Advisory Committee will review all submissions based on quality, relevance, impact and originality. Prospective authors are welcome to reference products in a design case study or as a proof of concept for a design methodology, as long as product references are presented in an appropriately non-commercial fashion. The deadline for abstract submissions is October 31. Detailed information on formatting and instructions for submitting an abstract or paper are available at www.ediconchina.com/papers2016.
This year's EDI CON China 2015 conference featured 95 technical papers sessions, 35 workshops, 9 plenary talks and 2 panel sessions with more than 2400 attendees during the 3 day event. The technical sessions were organized around tracks focused on RF, microwave and high-speed digital design, RF/MW measurement and modeling, EMC/EMI, high-speed digital measurements and modeling, system-level measurements and modeling, and system engineering. A new 5G Forum with a full day of sessions and workshops was added this year and will be featured again in 2016. For more information about EDI CON China 2016, please visit www.ediconchina.com.