EDI CON 2018 Call For Abstracts

Important Dates

  • TBA – Initial Call for Abstracts
  • TBA – Abstracts Due
  • TBA– Notice of Acceptance
  • TBA– Final Materials Due
  • Macrh 20-22, 2018 – China National Convention Center, Beijing, China.



Technical Sessions

The EDI CON technical sessions are educational, providing practical information on how to address today’s design challenges using available materials, tools, products, and techniques. Divided into technical tracks, the sessions are based on peer-reviewed abstracts and papers that have been evaluated by the EDI CON Technical Advisory Committee or from invited contributors. The technical tracks focus on a range of high frequency and high-speed electronic design issues from modeling and design through to characterization and system integration.
When submitting an abstract, authors select one of these tracks:

  • RF & Microwave Design
  • High-Speed Digital Design
  • Measurement & Modeling
  • Systems Engineering
  • 5G Advanced Communications
  • IoT Design
  • Radar Communications

Submitting a Proposal
Submit an abstract or preliminary paper describing a proposed technical session relating to your work in RF/microwave or high-speed digital design using the online system.

To be considered, the abstract must provide a sufficient level of technical detail for the Technical Advisory Committee. To be accepted, submissions must be high quality and robust, aimed at advancing the knowledge of attendees. Additional materials, such as a preliminary paper, can also be submitted at this time to help in the review process. Submissions will be evaluated per the criteria described below.

Evaluation Criteria
The EDI CON Technical Advisory Committee evaluates submissions based on quality, relevance, impact, and originality. Note that while prospective authors are welcome to reference products in a design case study or as a proof of concept for a design methodology, overt commercial content is NOT acceptable in session proposals.

  • Quality - Abstracts and papers should be well organized and easily understood.
  • Relevance - The proposed paper should be highly relevant to the interests of the EDI CON audience.
  • Impact - EDI CON papers should contribute to the educational mission of EDI CON, furthering the technical expertise of conference delegates. Submissions reporting on important results, methodologies or case studies of special significance will be considered favorably.
  • Originality - Reports on new design methodologies, case studies for innovative designs or other novel results contribute to the EDI CON goal of providing a high-quality educational program for practicing engineers. Outstanding papers on “classical” topics that help educate delegates on fundamental concepts, especially in new areas of interest will also be viewed favorably.

NOTE: Product promotion is not permitted in EDI CON technical sessions. Product promotion in a paper proposal will lead to rejection of the proposal. Product promotion in a paper or presentation may lead to requests for revision, the removal of promotional language from the paper and presentation by the conference organizers, or removal of the paper from the program. (It is acceptable to use a product in a design case study or as a proof of concept for a design methodology.)

Final Paper & Presentation Submissions
If a proposal is accepted, the author is required to submit a presentation by the final materials deadline (submitting a paper is optional). Presentations and papers will be available to all EDI CON conference delegates in the technical proceedings.

  • Technical papers should be between 2,000 and 3,000 words. They can contain mathematical formulas (any derivations of which should be placed in appendices) as well as a maximum of six images (including pictures or illustrative graphics such as cutaways, schematics, and graphs).
  • For presentations, use the presentation template in the speaker center.

Speaker Benefits & Responsibilities
If accepted into the program, speakers are automatically registered and will receive complimentary admission to all technical sessions, workshops, and panels. If a speaker must cancel his or her presentation, conference management expects the speaker to offer a substitute speaker from his or her work group or company. You must notify event management of any substitutions.

Papers accepted by EDI CON will appear in the conference program provided to delegates or made available through purchase from Microwave Journal and EDI CON. Accepted papers are eligible for publication by Microwave Journal and/or Microwave Journal China.

About the Technical Advisory Committee
The EDI CON Technical Advisory Committee (TAC) consists of designers, programmers, and engineers from the RF/microwave and high-speed digital design industries. They are well-recognized for their technical leadership and advanced expertise in their respective fields.

The committee, with the guidance of the technical program advisors and conference management, is responsible for recommending abstracts, commenting on improvements to abstracts, and encouraging abstract submissions. They provide valuable peer reviews of abstracts submitted in their areas of expertise, and recommend the sessions for inclusion in the final EDI CON program.

About the Conference Organizers
EDI CON China is organized by Microwave Journal and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as EDI CON USA as well as the IEEE MTT-S International Microwave Symposium for 35 years (until 2009) and the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.

Sample Topics
RF & Microwave Design sample topics:

  • LNA Design
  • RF/Microwave Filter and Diplexer Design
  • Power Amplifier design
  • Design Optimization for Efficiency and Linearity
  • Linearization and Pre-Distortion Techniques
  • Thermal Effects and Proper Heat-Sinking Techniques
  • RF Power Management
  • Antenna designs
  • Combining/Dividing Structures
  • Oscillator and Resonator Design
  • Mixer, Switch and Frequency Multiplier/Divider Design

High-Speed Digital Design sample topics:

  • Designing for Low Jitter
  • Chip/Package/Board Co-Design
  • Interconnect Design for SI and PI
  • Channel Simulation, Design, and Optimization
  • IBIS/AMI Models
  • Signal Integrity Performance

Measurement & Modeling Track sample topics

  • Active device Modeling
  • Nonlinear Measurements
  • Passive Device Modeling and EM Simulations/Optimization
  • RF Measurement Techniques for High Speed Design
  • Working with S-Parameters in the Time Domain
  • Behavioral Models
  • Model Representation in RF Simulation
  • Load Pull Techniques
  • Material Characterization
  • Package Modeling
  • Working with Advanced Materials (meta, nano, etc.)
  • Advanced RF/mW Semiconductors (GaN, GaAs, LDMOS, etc.)
  • Understanding and Modeling Phase Noise
  • Thermal Modeling/Multi-Physics Analysis

Systems Engineering Track sample topics:

  • Lower Power RF- i.e. Zigbee, NFC
  • Ultra low Power RF
  • MIMO OTA Testing
  • Remote Sensing
  • M2M
  • Backhaul
  • Millimeter wave Systems for Point-to-Point Radio
  • RADAR systems
  • Software Defined Radio
  • Automatic Test Systems

5G Advanced Communications Track sample topics:

  • Massive MIMO
  • Software Defined Radio
  • Alternative Modulation Schemes
  • mmWave Transceivers
  • Cognitive Radio
  • Small Cells
  • SoC

Janine Sullivan Love
Technical Program Director, EDI CON China
Horizon House Publications
Microwave Journal
Mobile: +1-857-350-2216