EDI CON 2019 Call For Abstracts

Important Dates

  • January 10, 2019 – Abstracts Due
  • March 17, 2019 – Slides & Papers Due
  • April 1-3, 2019 – China National Convention Center, Beijing, China.


Technical Sessions

EDI CON technical sessions are educational, providing information on how to address design challenges using available materials, tools, products, and techniques. The sessions are based on peer-reviewed abstracts and papers that have been evaluated by the EDI CON Technical Advisory Committee.

Authors select one of these tracks:

• 5G and Blockchain Technologies
• 5G/Advanced Communications
• mmWave Technologies
• RF/Microwave Amplifier Design
• Low Power RF and IoT
• Front End Design
• Power Integrity
• Radar and Defense
• RF and Microwave Design
• Signal Integrity
• Simulation and Modeling
• Test and Measurement

Evaluation Criteria
Abstracts are judged based on quality, relevance, impact, and originality. Good examples of abstracts include ones that report on important results, methodologies or case studies. It is acceptable to reference products in a design case study or as a proof of concept for a design methodology, but advertising and product promotion is NOT acceptable in session proposals.

Final Paper & Presentation Submissions
If a proposal is accepted, the author is required to submit a presentation by the final materials deadline (submitting a paper is optional). Presentations and papers will be available to all EDI CON conference delegates in the technical proceedings.

Presentations should use the presentation template in the speaker center.

Technical papers should be between 2,000 and 3,000 words. They can contain mathematical formulas as well as a maximum of six images.

Speaker Benefits & Responsibilities
If accepted into the program, speakers receive free admission to all technical sessions, workshops, and panels. If a speaker cannot attend, he or she should tell conference management and provide a substitute speaker from his or her work group or company. You must notify event management of any substitutions.

Papers accepted by EDI CON will appear in the conference proceedings provided to delegates or made available through purchase from Microwave Journal and EDI CON. Accepted papers are eligible for publication by Microwave Journal, Signal Integrity Journal, and/or Microwave Journal China.

About the Technical Advisory Committee
The EDI CON Technical Advisory Committee (TAC) consists of designers, programmers, and engineers from the RF/microwave and high-speed digital design industries. They are known for their technical leadership and advanced expertise. The committee recommends abstracts, comments on improvements to abstracts, and encourages abstract submissions.

About the Conference Organizers
EDI CON China is organized by Microwave Journal, Microwave Journal China, the Signal Integrity Journal, the event planning division of their parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets.

Sample Topics
Sample topics by track (event management may move an accepted abstract to a different track).

RF & Microwave Design sample topics:
• RF/Microwave filter and diplexer design
• Thermal effects and proper heat-sinking techniques
• RF power management
• Antenna design
• Combining/dividing structures
• Oscillator and resonator design
• Mixer, switch and frequency multiplier/divider design
• Transmitter/receiver design
• Patch antennas
• RF FPGA design

Mobile Front-End Design sample topics:
Carrier aggregation (CA)
• Dual carrier (DC)
• Licensed assisted access (LAA)
• MulteFire
• SAW/TC-SAW/BAW filter technologies

Low Power RF & IoT sample topics:
• Lower Power RF
• Ultra-low-power RF
• Remote sensing
• M2M
• Backhaul
• IoT antenna design

5G Advanced Communications sample topics:
• Massive MIMO
• Beamforming simulation
• Alternative modulation schemes
• mmWave transceivers
• Cognitive radio
• Small cells
• Backhaul
• SoC
• Design antenna modules for 5G

Broadband Networks sample topics:
• 802.11ac
• 802.11ax
• 802.11ad/WiGig
• Fixed wireless access (FWA)

Radar & Defense sample topics:
• Millimeter wave systems for point-to-point radio
• RADAR systems
• EW
• Communications
• Software defined radio
• Automatic test systems
• Radar PA design
• Automotive radar system design
• Design of sensors for self-driving vehicles, including radar and lidar

Amplifier Design sample topics:
• LNA Design
• Power Amplifier Design
• Design Optimization for Efficiency and Linearity
• Linearization and Pre-Distortion Techniques
• Ultra-sensitive low-noise amplifier design
• Amplifier testing

Signal Integrity sample topics:
• Channel optimization for low jitter and BER
• Common signal integrity
• Signal integrity benchmarking
• IBIS/AMI model verification
• PAM4 channel optimization
• Test fixture characterization and de-embedding
• Chip/package/PCB co-design
• Pin-assignment optmization
• High-speed connector characterizations and applications
• High speed memory design
• SerDes design flows
• HD signal routing
• New materials for high-speed designs
• Channel Metrics: single bit response, S-parameters, eye diagrams and contours, COM, and BER

Power Integrity sample topics:
Designing power interconnects
• Power distribution and management
• Power distribution network design methodologies
• Supply noise modeling and analysis
• Core logic voltage noise
• On-die capacitance
• Die package resonance
• Decoupling capacitor integration
• Power distribution network impedance
• Coupling among power domains
• Power filters
• Measuring very low power signals
• Design and characterization of power sources, DC-DC converters

EMI & EMC sample topics:
Modeling for product compliance
• Mitigating EMI issues
• Conducted emissions
• Antenna and probe design
• Near field/far field effects and measurements
• Common mode chokes

Simulation & Modeling sample topics:
Active Device Modeling
• Passive Device Modeling and EM Simulations/Optimization
• Behavioral Models
• Model Representation in RF Simulation
• Package Modeling
• Understanding and Modeling Phase Noise
• Thermal Modeling/Multi-Physics Analysis

Test & Measurement sample topics:
Evaluating Probe Designs & Options
• Nonlinear Measurements
• RF Measurement Techniques for High Speed Design
• Working with S-parameters in the Time Domain
• Load Pull Techniques
• Material Characterization
• Working with Advanced Materials (meta, nano, etc.)
• Advanced RF/mW Semiconductors (GaN, GaAs, LDMOS, etc.)
• Anechoic chamber verification
• Testing satellite system devices
• OTA and mmWaves measurements
• Test & Measurement challenges for high speed measurement
• High-speed calibration techniques
• Power distribution network measurement techniques
• Testing sensors for self-driving vehicles


Janine Sullivan Love
Technical Program Director, EDI CON China
Horizon House Publications
Microwave Journal
Mobile: +1-857-350-2216