A new kind of technical conference and trade show, developed for and by the high-frequency/high-speed electronics industry and Microwave Journal China.
June 15, 2012:
Conference registration opens. Early registration discount ends 12/31/12.
August 1, 2012:
Deadline for Papers and Workshop Submittal
Sept. 30, 2012:
Acceptance of Papers
Nov. 1, 2012:
Final Conference Program
March 12-14, 2013:
Electronic Design Innovations Conference
Thanks for Another Successful Year!
The EDI CON 2014 technical conference and exhibition attracted over 2,000 attendees for this 3 day industry-driven event held April 8-10 in Beijing, China. With a focus on RF/Microwave and high-speed electronic design, delegates and exhibiting companies shared information on the latest design tools and components targeting telecommunications, satellite navigation systems, radar and more.
DownloadEDI CON 2014 final report for prospective 2015 exhibitors
EDI CON 2015 April 14-16, 2015 Beijing, China
EDI CON 2015 moves to CNCC to Accommodate Growth Organizers of the Electronic Design Innovation Conference (EDI CON) have signed a contract with the China National Convention Center (CNCC) to host this industry-driven event for RF, microwave and high speed digital electronic designers on April 14-16, 2015 in Beijing, China. The venue change is necessary to accommodate the expected growth in the number of vendors participating in the exhibition next year. The success of the event this past April, which included record attendance and a sold out exhibition, led to the decision to move the event to the larger, newer facility. Read More
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
Paper submittals for EDI CON 2015 technical sessions begins June 1st, 2014. The technical paper sessions at EDI CON are educational in nature, providing practical information to electronics designers and engineers. Authors are invited to submit a preliminary paper and abstract describing their proposed technical paper relating to work in RF, microwave and high-speed digital electronic component or system-level design. Author information and the abstract must be submitted through the EDI CON conference management system (www.ediconchina.com/papers2015). Authors are requested to submit a comprehensive abstract that provides sufficient detail about the proposed paper if a preliminary paper is not being provided at the time of submission.
The sessions offered are designed to provide knowledge of electronic design tools and techniques. The technical sessions are divided into three concurrent technical tracks. Each session will feature two twenty-minute long technical papers from invited contributors or selected from papers submitted to the EDI CON Technical Advisory Committee. The technical tracks focus on a range of high frequency/high speed electronic design issues from component characterization through system integration.
3 Day peer-reviewed industry-focused technical conference
86 peer reviewed papers
5 panel sessions
1 Keysight Technologies Education forum
8 keynote talks from Industry executives, leading researchers and academics
Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EMC, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. The technical sessions are organized around tracks focused on RF, microwave and high-speed digital design, RF/mW measurement and modeling, EMC/EMI, high-speed digital measurements and modeling, system-level measurements and modeling, system engineering and commercial resources.
Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
EDI CON 2015 will feature special expert panels discussing specific topics impacting technology today. Led by a moderator with interaction from audience members, experts will provide a brief overview of their position on the challenges and potential solutions impacting a specific technology or application. Past panel themes included the State of GaN in China, MIMO OTA test, EDA design flows, Aligning RF semiconductor technology to end-use applications, and Trends in future telecommunications systems and their engineering challenges.
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. This year’s exhibition doubles the size of 2013 with twice the exhibition space and number of exhibitors. The exhibition halls feature test and measurement equipment and simulation software (EDA) vendors in the west hall and semiconductor, integrated device manufacturers, materials, components and distributors in the east hall. A schedule of events in the exhibition will ensure a lively and productive exchange between vendors and attending engineers.
October 31, 2014: Material deadline for submitting paper proposals, including title and abstract/summary, author bio/pic. initial drafts also accepted
November 30, 2014 - Notification of acceptance
January 31, 2015 - Final materials due
EDI CON 2015 Changes Beijing Venue to Accommodate Expected Growth Beijing, China - May 19, 2014: Organizers of the Electronic Design Innovation Conference (EDI CON) have signed a contract with the China National Convention Center (CNCC) to host this industry-driven event for RF, microwave and high speed digital electronic designers on April 14-16, 2015 in Beijing, China. The venue change is necessary to accommodate the expected growth in the number of vendors participating in the exhibition next year. The success of the event this past April, which included record attendance and a sold out exhibition, led to the decision to move the event to the larger, newer facility. Read More
EDI CON Papers Focus on MIMO Technology March 6, 2014 – Norwood Massachusetts:
EDI CON 2014 to be held at the Beijing International Convention Center, April 8th through 10th will feature a dozen technical papers and workshops on MIMO design and related test/verification solutions. In addition, the exhibition will feature products and demonstration from leading MIMO test and measurement equipment providers such as Spirent Communications, Agilent Technologies, Microwave Vision Group, General Test Systems (Tri-L), National Instruments and more. Read More
MACOM to showcase highly integrated, plastic-packaged GaN solutions at EDI CON February 27, 2014 – Norwood Massachusetts: M/A-COM Technology Solutions Inc.("MACOM"), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD. Read More
EDI CON exhibitors are at the forefront of high frequency electronic design, providing the technology solutions and products that are used by engineers in the design of next generation systems addressing the telecommunications, computing, aerospace and wireless consumer electronics sectors.