EDI CON China celebrates electronic design innovation, bringing together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities.
Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.
Drawing attendees working on analog and digital designs, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges.
The exhibition hall features product displays, demonstrations, networking opportunities, and poster sessions that address all aspects of design, simulation, test, and verification.
The technical sessions and workshops offer insights and instruction on electronic design tools and techniques. Each session includes a twenty-minute technical talk from invited contributors or selected from papers submitted to the EDI CON Technical Advisory Committee. The abstracts for these presentations are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of RF, microwave, signal integrity, power integrity, and EMC/EMI design. The technical sessions are organized around tracks such as RF & Microwave Design, 5G Advanced Communications, Radar, Amplifier Design, Signal Integrity, Power Integrity, EMC/EMI, Simulation & Modeling, and Test & Measurement.
Workshops (40 minutes) allow industry experts to share information on specific challenging and emerging topics related to high frequency or high-speed electronic design. Workshops are an interactive experience, allowing time for audience questions and may include demonstrations of design software and/or measurement equipment. Sponsors are responsible for workshops content according to the guidelines set by the EDI CON organizers.
In these sessions, a panel of experts discusses a particular topic of interest. After an opening statement introducing his or her perspective on the forum topic, a moderator engages panelists in a deeper discussion that is driven by questions from the audience. EDI CON coordinates the panel topics, invited speakers, and moderator. Past panel topics include: OTA Testing, 5G MIMO, Automotive Electronics, Trends in Mobile Infrastructure, and RF Energy.
EDI CON brings together leading RF, microwave, high-speed digital components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other events, EDI CON has industrial and technology experts delivering the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.
EDI CON China 2018 Breaks Records in Beijing
April 18, 2018 Norwood, Massachusetts: EDI CON China 2018 enjoyed a year of record growth in both attendance and exhibition space March 20-22, 2018 at the China National Convention Center (CNCC) in Beijing, China. In its sixth year, EDI CON CHINA continues to be the largest microwave and high-speed digital design conference and exhibition in China.
EDI CON China 2018 Announces Keynote Speakers
February 23, 2018 – Norwood Massachusetts: EDI CON China 2018, a conference and exhibition that brings together engineers working on high-frequency analog and high-speed digital designs, taking place March 20-22, 2018 at the China National Convention Center (Beijing, China), announces the lineup for its plenary keynote sessions at this year’s event. EDI CON China 2018 will feature two plenary keynote sessions, one with industry experts focusing on 5G on March 20th at 9:30AM and one with leading experts focusing on innovation on March 21st at 9:30AM.
EDI CON China 2018 Opens Call For Abstracts
September 25, 2017 – Norwood Massachusetts: EDI CON China 2018, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place March 20-22, 2018 at the China National Convention Center (Beijing, China), announces the Call for Abstracts for its technical sessions is open. All submitted abstracts will be evaluated by the EDI CON CHINA 2018 Technical Advisory Committee for quality and educational relevance for conference attendees.
EDI CON China 2017 Succeeds in Shanghai
May 1, 2017 – Norwood Massachusetts: EDI CON China 2017 enjoyed a successful inaugural conference and exhibition at the Shanghai Convention & Exhibition Center of International Sourcing in Shanghai China on April 25-27, 2017. This was the fifth year for EDI CON CHINA, the largest microwave, EMC/EMI and high-speed digital design conference and exhibition in China, but the first time that the event came to Shanghai.