EDI CON China
Organized by:
Horizon House Publishing
ACT International
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A new kind of technical conference and trade show, developed for and by the
high-frequency/high-speed electronics industry and Microwave Journal China.

 

Important Dates

June 15, 2012:

Conference registration opens. Early registration discount ends 12/31/12.

August 1, 2012:

Deadline for Papers and Workshop Submittal

Sept. 30, 2012:

Acceptance of Papers

Nov. 1, 2012:

Final Conference Program

March 12-14, 2013:

Electronic Design Innovations Conference

 

 

Thanks for Another Successful Year!

The EDI CON 2014 technical conference and exhibition attracted over 2,000 attendees for this 3 day industry-driven event held april 8-10 in Beijing, China. With a focus on RF/Microwave and high-speed electronic design, delegates and exhibiting companies shared information on the latest design tools and components targeting telecommunications, satellite navigation systems, radar and more.

April 8-10, 2014
Beijing, China
www.EDICONCHINA.com

EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.

2014 PLENARY SESSION PRESENTATIONS

The EDI CON 2014 plenary sessions will open the EDI CON technical program on April 8th at 9:30 am in the Beijing International Conference Center's main auditorium. Two sessions will feature guests from leading research institutes, universities and industry with opening remarks from this year’s Chair Emeritus, Dr. Professor Song Junde of the Beijing University of Posts and Telecommunications. Also featured in the opening plenary session will be Dr. Erping Li, Chair Professor RF and Nanoelectronics Research Center, Zhejiang University and Keming Feng, General Manager, Beijing Institute of Radio Metrology and Measurements and Mario
Narduzzi
, Marketing Manager of Agilent Technologies. The second plenary session will examine current and future trends in telecommunications with keynote talks from Corbett Rowell of China Mobile Research Institute, James Kimery, Marketing Director with National Instruments and Josef Wolf, Director of Spectrum/Network Network Analysis and EMC, Rohde & Schwarz.

2014 TECHNICAL PROGRAM


Download 2014 Program

3 Day peer-reviewed industry-focused technical conference

  • 86 peer reviewed papers
  • 30 workshops
  • 5 panel sessions
  • 1 Agilent Education forum
  • 8 keynote talks from Industry executives, leading researchers and academics

Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EMC, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. The technical sessions are organized around tracks focused on RF, microwave and high-speed digital design, RF/mW measurement and modeling, EMC/EMI, high-speed digital measurements and modeling, system-level measurements and modeling, system engineering and commercial resources.

2014 WORKSHOPS

Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.

2014 PANELS

EDI CON 2014 will feature five special expert panels discussing specific topics impacting technology today. Led by a moderator with interaction from audience members, experts will provide a brief overview of their position on the challenges and potential solutions impacting a specific technology or application. Panel themes will include the State of GaN in China, MIMO OTA test, EDA design flows, Aligning RF semiconductor technology to end-use applications, and Trends in future telecommunications systems and their engineering challenges.

2014 EXHIBITION


Download 2014 Show Guide

EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. This year’s exhibition doubles the size of 2013 with twice the exhibition space and number of exhibitors. The exhibition halls feature test and measurement equipment and simulation software (EDA) vendors in the west hall and semiconductor, integrated device manufacturers, materials, components and distributors in the east hall. A schedule of events in the exhibition will ensure a lively and productive exchange between vendors and attending engineers.

List of EDI CON 2014 Exhibitors

EDI CON 2014 Floor plan

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IMPORTANT DATES

Initial Call for Papers: June 1, 2014

October 31, 2014: Material deadline for submitting paper proposals, including title and abstract/summary, author bio/pic. initial drafts also accepted

November 30, 2014 - Notification of acceptance

January 31, 2015 - Final materials due

NEWS

EDI CON Papers Focus on MIMO Technology
March 6, 2014 – Norwood Massachusetts: EDI CON 2014 to be held at the Beijing International Convention Center, April 8th through 10th will feature a dozen technical papers and workshops on MIMO design and related test/verification solutions. In addition, the exhibition will feature products and demonstration from leading MIMO test and measurement equipment providers such as Spirent Communications, Agilent Technologies, Microwave Vision Group, General Test Systems (Tri-L), National Instruments and more.
Read More

MACOM to showcase highly integrated, plastic-packaged GaN solutions at EDI CON
February 27, 2014 – Norwood Massachusetts: M/A-COM Technology Solutions Inc.("MACOM"), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD.
Read More

RF Semiconductor Technology Drives the EDI CON 2014 Technical Program
February 27, 2013 – Integrated circuits and semiconductor technology are critical to the overall performance of electronic systems, whether the application is for mobile communications, radar or satellite navigation. The design track reflects the industry’s focus on recent advances in design technology with an emphasis on specific components such as filters and power amplifiers. Doherty and class-F PA architectures along with techniques such as digital pre-distortion and envelop tracking that are garnering so much industry attention at the moment will be among the hot topics presented in the field of power amplifier design.
Read More

EXHIBITORS

EDI CON exhibitors are at the forefront of high frequency electronic design, providing the technology solutions and products that are used by engineers in the design of next generation systems addressing the telecommunications, computing, aerospace and wireless consumer electronics sectors.

Information | Exhibitor List | Floor Plan