Welcome to EDI CON China 2019!

EDI CON China celebrates electronic design innovation, bringing together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities.

Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.

Drawing attendees working on analog and digital designs, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges.

The exhibition hall features product displays, demonstrations, networking opportunities, and poster sessions that address all aspects of design, simulation, test, and verification.

Technical Program

The technical sessions and workshops offer insights and instruction on electronic design tools and techniques. Each session includes a twenty-minute technical talk from invited contributors or selected from papers submitted to the EDI CON Technical Advisory Committee. The abstracts for these presentations are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of RF, microwave, signal integrity, power integrity, and EMC/EMI design. The technical sessions are organized around tracks such as RF & Microwave Design, 5G Advanced Communications, Radar, Amplifier Design, Signal Integrity, Power Integrity, EMC/EMI, Simulation & Modeling, and Test & Measurement.

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Workshops (40 minutes) allow industry experts to share information on specific challenging and emerging topics related to high frequency or high-speed electronic design. Workshops are an interactive experience, allowing time for audience questions and may include demonstrations of design software and/or measurement equipment. Sponsors are responsible for workshops content according to the guidelines set by the EDI CON organizers.

Expert Panels

In these sessions, a panel of experts discusses a particular topic of interest. After an opening statement introducing his or her perspective on the forum topic, a moderator engages panelists in a deeper discussion that is driven by questions from the audience. EDI CON coordinates the panel topics, invited speakers, and moderator. 2019 panel topics include: 5G OTA Testing and State of GaN Technology.

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EDI CON brings together leading RF, microwave, high-speed digital components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other events, EDI CON has industrial and technology experts delivering the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.

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EDI CON China Announces Innovation Award Winners
April 3, 2019 - Norwood Massachusetts: On April 2, EDI CON China 2019 announced the winners and presented the trophies to company representatives in its second annual EDI CON CHINA Product Innovation Awards. The ceremony was presided over by Winson Xing, Editor Microwave Journal China, and Carl Sheffres, Publisher of Microwave Journal & Exhibition Manager.
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EDI CON China Announces Innovation Award Finalists
March 11, 2019 - Norwood, Massachusetts: EDI CON China 2019, taking place April 1-3, 2019 at the China National Convention Center (Beijing, China), has announced the finalists in the second annual EDI CON CHINA Product Innovation Awards.
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Keynote Speakers Announced for EDI CON China
February 22, 2019 - Norwood, Massachusetts: EDI CON China 2019, taking place April 1-3, 2019 at the China National Convention Center (Beijing, China), has announced its lineup of keynote speakers for this year’s event. The keynotes will kick off the three-day conference and exhibition at 9:30 on Monday April 1 in Function Hall A (1st Floor).
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